PCB Assembly Warpage

PCB assemblies are becoming more complex, with thin components and thick boards. The distribution of copper inside the PCB is important in determining the shape and magnitude of the PCB during assembly, operation and shock. 

PCB assembly warpage analysis helps engineers ensure durable and reliable PCB designs such that it will pass thermal, vibration and manufacturing loads.

 
 Map of layer by layer copper trace on a typical PCB assembly

Map of layer by layer copper trace on a typical PCB assembly

Trace Mapping

The first step in an accurate PCBA warpage analysis is to include the distribution of the copper inside the PCB. In modern PCBA, assuming uniformed copper distribution is not sufficient for thermal, warpage and vibration analysis. We include as much detail as needed to guarantee accurate prediction of the PCB shape.

 PCB warpage during solder reflow

PCB warpage during solder reflow

Solder Reflow simulation

Lead free solder requires very high solder reflow temperatures. This leads to failures during the manufacturing process such as broken solder or misaligned packages.

Simulation can help to predict issues and improve yield during the design process so that your PCB design is reliable the first time

 3 sigma deformation due to random vib

3 sigma deformation due to random vib

Random Vibrations

Vibrations often cause PCBA failure over time.  Various levels of simulation can be used to improve product durability and product life.

Our customers typically start with simulation to help improve design and move to accurate life prediction over time with the availability of experimental data.