Predicting aerodynamic damping through simulation is possible by combining ANSYS Mechanical and ANSYS CFX. This method can be use for turbine blades, aircraft wings or MEMS micro mirrors!
Devices with small gaps (~1mm) can get away with conduction based thermal simulations.
Shaking your electronics is bad. After awhile, they tend to break. Simulation can predict how long they last, but there are many decisions to be made. You need to understand the type of vibration and what components you are most concerned with in order to use simulation effectively.
Heat can cause solder to crack. There are 2 paths for simulation: Fast rough estimates based on closed form equations. Or detailed, accurate FEA model of solder balls.
We are starting a blog and to celebrate this milestone, we will blog a blog about our blog.
This is some pretty deep meta stuff here right? But in our blogging future, we will keep it packed with content and fun!
Our blog is about engineering simulations.
Those of us who’s been doing this for awhile know what there are many ways to skin a ….. problem. So we will draw out a simple road map to help folks understand their options.
We plan to discuss stuff you’d expect like electronics reliability, microfluidics and antenna design etc. We’ll also do some fun stuff like aeroacoustics, control system and polymer extrusion.
Got a suggestion? Let us know! We will put our heads together and knock something out.
The Singularity Engineering Team